Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11024603 | Manufacturing method and a related stackable chip package | Ming-Chih Chen, Hung-Hsin Hsu, Chi-An Wang, Hsien-Wen Hsu | 2021-06-01 |
| 10892250 | Stacked package structure with encapsulation and redistribution layer and fabricating method thereof | Ming-Chih Chen, Hung-Hsin Hsu, Hsien-Wen Hsu | 2021-01-12 |
| 10354978 | Stacked package including exterior conductive element and a manufacturing method of the same | Ming-Chih Chen, Hung-Hsin Hsu, Chi-An Wang, Hsien-Wen Hsu | 2019-07-16 |
| 10224254 | Package process method including disposing a die within a recess of a one-piece material | Ming-Chih Chen, Hsien-Wen Hsu, Hung-Hsin Hsu | 2019-03-05 |
| 9659884 | Carrier substrate | Hsien-Wen Hsu | 2017-05-23 |