Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
CW

Chi-An Wang — 9 Patents

PTPowertech Technology: 6 patents #12 of 136Top 9%
UMUnited Microelectronics: 2 patents #1,942 of 4,560Top 45%
TSMC: 1 patents #8,466 of 12,232Top 70%
Hengshan, TW: #247 of 1,564 inventorsTop 20%
Overall (All Time): #535,341 of 4,157,543Top 15%
9 Patents All Time
Chi-An Wang has been granted 9 US patents while listed as an inventor at Powertech Technology. The first was granted in 2019 and the most recent in December 2024. Chi-An Wang ranks #535,341 of 4,157,543 US inventors in our database (top 12.9%). Patent records list Chi-An Wang in Hengshan, TW.

Patents per Year

Patents granted per year, 2019 to 2024Bar chart with a peak of 5 patents in 2019.peak 52019: 5 patents20192021: 1 patents20212022: 1 patents20222024: 2 patents2024

Issued Patents All Time

Showing 1–9 of 9 patents

Patent #TitleCo-InventorsDateApprox Value ⓘ
12176390 Semiconductor device structure and method for forming the semiconductor device structure Chun-Fai Cheng, Liang Chen, Kuan-Chung Chen, Chih-Wei Lee 2024-12-24 $21,208,000
12089394 Semiconductor structure Kai Jen, Wei-Che Chang 2024-09-10 $618,000
11495605 Semiconductor structure and manufacturing method thereof Kai Jen, Wei-Che Chang 2022-11-08
11024603 Manufacturing method and a related stackable chip package Ming-Chih Chen, Hung-Hsin Hsu, Yuan-Fu Lan, Hsien-Wen Hsu 2021-06-01
10424526 Chip package structure and manufacturing method thereof Hung-Hsin Hsu, Wen-Hsiung Chang 2019-09-24
10354978 Stacked package including exterior conductive element and a manufacturing method of the same Ming-Chih Chen, Hung-Hsin Hsu, Yuan-Fu Lan, Hsien-Wen Hsu 2019-07-16
10276553 Chip package structure and manufacturing method thereof Hung-Hsin Hsu 2019-04-30
10177060 Chip package structure and manufacturing method thereof Hung-Hsin Hsu 2019-01-08
10170458 Manufacturing method of package-on-package structure Hung-Hsin Hsu 2019-01-01