Issued Patents All Time
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12176390 | Semiconductor device structure and method for forming the semiconductor device structure | Chun-Fai Cheng, Liang Chen, Kuan-Chung Chen, Chih-Wei Lee | 2024-12-24 |
| 12089394 | Semiconductor structure | Kai Jen, Wei-Che Chang | 2024-09-10 |
| 11495605 | Semiconductor structure and manufacturing method thereof | Kai Jen, Wei-Che Chang | 2022-11-08 |
| 11024603 | Manufacturing method and a related stackable chip package | Ming-Chih Chen, Hung-Hsin Hsu, Yuan-Fu Lan, Hsien-Wen Hsu | 2021-06-01 |
| 10424526 | Chip package structure and manufacturing method thereof | Hung-Hsin Hsu, Wen-Hsiung Chang | 2019-09-24 |
| 10354978 | Stacked package including exterior conductive element and a manufacturing method of the same | Ming-Chih Chen, Hung-Hsin Hsu, Yuan-Fu Lan, Hsien-Wen Hsu | 2019-07-16 |
| 10276553 | Chip package structure and manufacturing method thereof | Hung-Hsin Hsu | 2019-04-30 |
| 10177060 | Chip package structure and manufacturing method thereof | Hung-Hsin Hsu | 2019-01-08 |
| 10170458 | Manufacturing method of package-on-package structure | Hung-Hsin Hsu | 2019-01-01 |