Issued Patents All Time
Showing 76–80 of 80 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8048721 | Method for filling multi-layer chip-stacked gaps | Wei-Chih Chien | 2011-11-01 |
| 7902666 | Flip chip device having soldered metal posts by surface mounting | Jui-Ching Hsu | 2011-03-08 |
| 7879648 | Fabrication method for high pin count chip package | Hsing-Der Chung | 2011-02-01 |
| 7663204 | Substrate for multi-chip stacking, multi-chip stack package utilizing the substrate and its applications | Chih-Wei Wu | 2010-02-16 |
| 7605462 | Universal substrate for a semiconductor device having selectively activated fuses | Chi-Chung Yu | 2009-10-20 |