Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8212349 | Semiconductor package having chip using copper process | Hung-Hsin Hsu, Chin-Ming Hsu | 2012-07-03 |
| 7902666 | Flip chip device having soldered metal posts by surface mounting | Hung-Hsin Hsu | 2011-03-08 |