CH

Che-Wei Hsu

PC Phoenix Pioneer Technology Co.: 28 patents #2 of 24Top 9%
SM Silicon Motion: 18 patents #21 of 414Top 6%
TSMC: 18 patents #1,811 of 12,232Top 15%
GC Giant Manufacturing Co.: 15 patents #1 of 99Top 2%
PT Princeton Technology: 4 patents #19 of 135Top 15%
PH Phoenix: 4 patents #20 of 153Top 15%
AC Ace Cad Enterprise Co.: 3 patents #3 of 6Top 50%
IT ITRI: 3 patents #2,499 of 9,619Top 30%
NU National Central University: 3 patents #56 of 733Top 8%
ZC Zhen Ding Technology Co.: 2 patents #37 of 98Top 40%
CC Cheng Uei Precision Industry Co.: 2 patents #208 of 502Top 45%
ET Elite Semiconductor Memory Technology: 2 patents #23 of 77Top 30%
MC Merry Electronics(Shenzhen) Co.: 2 patents #32 of 123Top 30%
HL Himax Technologies Limited: 1 patents #317 of 600Top 55%
EC Evolutive Labs Co.: 1 patents #8 of 12Top 70%
PT Phoenix Precision Technology: 1 patents #26 of 42Top 65%
QC Quanta Computer: 1 patents #690 of 1,295Top 55%
CA Cashido: 1 patents #5 of 9Top 60%
IN Inventec: 1 patents #521 of 1,270Top 45%
NU National Tsing Hua University: 1 patents #672 of 2,036Top 35%
NF Ncku Research And Development Foundation: 1 patents #34 of 82Top 45%
NM Novatek Microelectronics: 1 patents #575 of 986Top 60%
📍 Dashulong, TW: #17 of 596 inventorsTop 3%
Overall (All Time): #10,614 of 4,157,543Top 1%
116
Patents All Time

Issued Patents All Time

Showing 76–100 of 116 patents

Patent #TitleCo-InventorsDate
10117340 Manufacturing method of package substrate with metal on conductive portions Shih-Ping Hsu, Pao-Hung Chou 2018-10-30
10088868 Portable electronic device for acustic imaging and operating method for the same Diego Jose Hernandez Garcia, Yi-Lin Hsieh, Chih-Hung Lee 2018-10-02
10002823 Packaging substrate and method of fabricating the same Chu-Chin Hu, Shih-Ping Hsu, Chin-Ming Liu, Chih-Kuai Yang 2018-06-19
9992879 Package substrate with metal on conductive portions and manufacturing method thereof Shih-Ping Hsu, Pao-Hung Chou 2018-06-05
9893003 Package substrate and flip-chip package circuit including the same Shih-Ping Hsu 2018-02-13
9831217 Method of fabricating package substrates Chu-Chin Hu, Shih-Ping Hsu, Chin-Ming Liu, Chih-Kuai Yang 2017-11-28
9831165 Interposer substrate and method of manufacturing the same Shih-Ping Hsu, Chih-Wen Liu 2017-11-28
9815161 Backlash automatic detection system for machine tool and method using the same Yi-Ying Lin, Shih-Je Shiu, Po-Hsun Wu, Chien-Yi Lee 2017-11-14
9805996 Substrate structure and manufacturing method thereof Shih-Ping Hsu, Chin-Ming Liu, Chih-Kuai Yang 2017-10-31
9779022 Methods for caching and reading data to be programmed into a storage unit and apparatuses using the same Yang Shen 2017-10-03
9772618 Cutting tool controller and method of controlling the same Chien-Yi Lee, Yi-Ying Lin, Shih-Je Shiu, Yung-Ming Kao 2017-09-26
9747206 Methods for reprogramming data and apparatuses using the same 2017-08-29
9676434 Bicycle seat Chi-Ming Wu 2017-06-13
9583436 Package apparatus and manufacturing method thereof Chao-Tsung Tseng, Shih-Ping Hsu, Chin-Ming Liu 2017-02-28
9573650 Hidden hydraulic structure of bike disc brake I-Teh CHEN 2017-02-21
9548234 Package substrate and flip-chip package circuit including the same Shih-Ping Hsu 2017-01-17
9387519 Dewaxing device Cheng-Yu Chou, Cheng An Chiang, Chih-Wei Cheng 2016-07-12
9377163 Method of manufacturing a hydrogen storage device Cheng-Yu Chou, Chih-Wei Cheng 2016-06-28
9370105 Package apparatus with multiple pillar layers Shih-Ping Hsu 2016-06-14
9338900 Interposer substrate and method of fabricating the same Pao-Hung Chou, Shih-Ping Hsu 2016-05-10
9265146 Method for manufacturing a multi-layer circuit board Shih-Ping Hsu 2016-02-16
9214437 Package method Shih-Ping Hsu 2015-12-15
9039024 Bicycle seatpost Hui-Yuan Su, Owen Chang 2015-05-26
9015936 Method for manufacturing IC substrate Shih-Ping Hsu 2015-04-28
8905473 Seat adjusting module Hui-Yuan Su 2014-12-09