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Home › Self-aligned metal cut and via for back-end-of-line (BEOL) processes for semiconductor integrated circuit (IC) fabrication, and related processes and devices

Self-aligned metal cut and via for back-end-of-line (BEOL) processes for semiconductor integrated circuit (IC) fabrication, and related processes and devices

US Patent 9793164 · Granted Oct 17, 2017

Estimated economic value: $10,149,000 ⓘ

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