Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Multichip integration with through silicon via (TSV) die embedded in package

Multichip integration with through silicon via (TSV) die embedded in package

US Patent 9716084 · Granted Jul 25, 2017

Estimated economic value: $17,281,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Solder interconnect hierarchy for heterogeneous electronic device packaging2025
Electroless plating process2025
Microelectronic assemblies including interconnects with different solder materia2025
Steam cleaning apparatus2025
Optimization for raster scanning2025
Die last and waveguide last architecture for silicon photonic packaging2025
Methods and apparatus to reduce defects in interconnects between semiconductor d2025
Carrier chuck and methods of forming and using thereof2025
Package with underfill containment barrier2025
Method and device for driving a display panel and display device2025
Chiplet first architecture for die tiling applications2025
Inorganic-based embedded-die layers for modular semiconductive devices2025