Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Methods for processing a substrate using multiple substrate support positions

Methods for processing a substrate using multiple substrate support positions

US Patent 9315891 · Granted Apr 19, 2016

Estimated economic value: $19,369,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Broadband supply circuitry for a plasma processing system2025
Low resistivity metal contact stack2025
Apparatus for improved high pressure plasma processing2025
Gap fill methods using catalyzed deposition2025
EM source for enhanced plasma control2025
Methods for removing etch stop layers2025
Method of depositing metal films2025
Coupler2025
Low resistivity tungsten film and method of manufacture2025
Methods for copper doped hybrid metallization for line and via2024
Arc management algorithm of RF generator and match box for CCP plasma chambers2024
Methods and apparatus for processing a substrate2024