Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Optimization metallization for prevention of dielectric cracking under controlled collapse chip connections

Optimization metallization for prevention of dielectric cracking under controlled collapse chip connections

US Patent 8796133 · Granted Aug 5, 2014

Estimated economic value: $3,332,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Electronic substrate stacking2024
Asymmetric die bonding2023
Forming ultra-thin chips for flexible electronics applications2022
Enhancement of iso-via reliability2022
Multi-chip package structure having high density chip interconnect bridge with e2021
Shielded package assemblies with integrated capacitor2021
Flexible electronics for wearable healthcare sensors2021
Dielectric crack stop for advanced interconnects2021
Piezoelectronic device with novel force amplification2021
Advanced crack stop structure2021
Advanced crack stop structure2021
Techniques to improve reliability in Cu interconnects using Cu intermetallics2021