{"@context": "https://schema.org", "@type": "BreadcrumbList", "itemListElement": [{"@type": "ListItem", "position": 1, "name": "Home", "item": "https://www.patentleaderboard.com/"}, {"@type": "ListItem", "position": 2, "name": "Integrated circuit and process for fabricating thereof", "item": "https://www.patentleaderboard.com/patent/7998857"}]}
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Home › Integrated circuit and process for fabricating thereof

Integrated circuit and process for fabricating thereof

US Patent 7998857 · Granted Aug 16, 2011

Estimated economic value: $18,060,000 ⓘ

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