Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Interconnect structures with encasing cap and methods of making thereof

Interconnect structures with encasing cap and methods of making thereof

US Patent 7488677 · Granted Feb 10, 2009

Estimated economic value: $5,620,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Reduced capacitance between power via bar and gates2025
Backside self aligned skip via2025
Airgap spacer for power via2025
Semiconductor passive device integration for silicon-on-insulator substrate2025
Early backside first power delivery network2025
Local interconnects having different material compositions2025
Source/drain contact at tight cell boundary2025
BEOL interconnect subtractive etch super via2025
Interconnect structures with vias having vertical and horizontal sections2025
Wrap around metal via structure2025
Layered bottom electrode dielectric for embedded MRAM2025
Metal hard mask integration for active device structures2025