Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Method and structure for implementing secure multichip modules for encryption applications

Method and structure for implementing secure multichip modules for encryption applications

US Patent 7281667 · Granted Oct 16, 2007

Estimated economic value: $5,691,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Resist patterned redistribution wiring on copper polyimide via layer2025
Stacked semiconductor devices with topside and backside interconnect wiring2025
Dual redistribution layer structure2025
TSV and backside power distribution structure2025
Tearing security feature of printed circuit substrates2025
Infrared debond damage mitigation by copper fill pattern2025
Electronic component comprising first and second conductive traces and a void fo2025
Sintering a nanoparticle paste for semiconductor chip join2025
Phase aligning and calibrating clocks from one phase lock loop (PLL) for a two-c2024
Substrate thinning for a backside power distribution network2024
Semiconductor device with early buried power rail (BPR) and backside power distr2024
High density interconnection and wiring layers, package structures, and integrat2024