Semiconductor package and method for producing heat-radiating substrate for it

Assignee

• Tokyo Tungsten Co.

Inventors

• Norio Hirayama (15 patents)
• Mitsuo Osada (16 patents)
• Akira Ichida (8 patents)
• Yoshinari Amano (14 patents)
• Kiyoshi Asai (71 patents)
• Hidetoshi Maesato (5 patents)
• Tadashi Arikawa (9 patents)
• Kenji Sakimae (2 patents)

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