Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Electrical isolation in panels of leadless IC packages

Electrical isolation in panels of leadless IC packages

US Patent 6399415 · Granted Jun 4, 2002

Estimated economic value: $10,272,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Thin foil semiconductor package2014
Foil plating for semiconductor packaging2014
DC/DC converter power module package incorporating a stacked controller and cons2014
Stacked leadframe implementation for DC/DC convertor power module incorporating 2013
Method of making foil based semiconductor package2013
Foil plating for semiconductor packaging2013
Thin foil semiconductor package2013
Method and leadframe for packaging integrated circuits2012
Microarray package with plated contact pedestals2012
Multiple leadframe package2012
Foil based semiconductor package2012
Integrated circuit package with molded insulation2011