Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Method for making interconnect for low temperature chip attachment

Method for making interconnect for low temperature chip attachment

US Patent 6340630 · Granted Jan 22, 2002

Estimated economic value: $24,243,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Ultrasonic-assisted solder transfer2023
Combination polyimide decal with a rigid mold2022
Continuous solder transfer to substrates2021
Stacked semiconductor devices having dissimilar-sized dies2020
Gallium liquid metal embrittlement for device rework2020
Metal cored solder decal structure and process2020
Architecture and implementation of cortical system, and fabricating an architect2020
Gallium liquid metal embrittlement for device rework2020
Architecture and implementation of cortical system, and fabricating an architect2019
Thermally enhanced package to reduce thermal interaction between dies2019
Plasma-chemical coating apparatus2019
Metal cored solder decal structure and process2018