Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Metal cored solder decal structure and process

Metal cored solder decal structure and process

US Patent 10658267 · Granted May 19, 2020

Estimated economic value: $2,035,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Solder-shielded chip bonding2025
Uniform chip gaps via injection-molded solder pillars2024
System and method for forming solder bumps2024
Molten solder injection head with vacuum filter and differential gauge system2023
Hybrid under-bump metallization component2023
Method and apparatus of processor wafer bonding for wafer-scale integrated super2023
Ultrasonic-assisted solder transfer2023
Ultrasonic-assisted solder transfer2023
Ultra-thin microbattery packaging and handling2022
Hermetic packaging of a micro-battery device2022
Simplified hermetic packaging of a micro-battery2022
Simplified hermetic packaging of a micro-battery2022