Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Enhanced solder surface and process for chemically and mechanically enhancing solder surface properties

Enhanced solder surface and process for chemically and mechanically enhancing solder surface properties

US Patent 6210547 · Granted Apr 3, 2001

Estimated economic value: $36,356,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Method and apparatus for strain relieving surface mount attached connectors2020
Flat laminate, symmetrical test structures and method of use to gauge white bump2020
Test cell for laminate and method2019
Method and apparatus for strain relieving surface mount attached connectors2019
Heat sink attachment on existing heat sinks2019
Test cell for laminate and method2019
Fixture to constrain laminate and method of assembly2018
Method and apparatus for strain relieving surface mount attached connectors2018
Flat laminate, symmetrical test structures and method of use to gauge white bump2018
Heat sink attachment on existing heat sinks2018
Method and apparatus for strain relieving surface mount attached connectors2017
Electronic components on trenched substrates and method of forming same2016