Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Thermosetting iodine- and silicon-containing material, composition containing the material for forming resist underlayer film for EUV lithography, and patterning process

Thermosetting iodine- and silicon-containing material, composition containing the material for forming resist underlayer film for EUV lithography, and patterning process

US Patent 11914295 · Granted Feb 27, 2024

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Material for forming adhesive film, method for forming adhesive film using the s2025
Material for forming adhesive film, method for forming adhesive film using the s2025
Material for forming organic film, patterning process, and polymer2025
Material for forming adhesive film, patterning process, and method for forming a2025
Material for forming adhesive film, patterning process, and method for forming a2025
Thermosetting iodine- and silicon-containing material, composition containing th2025
Thermosetting iodine- and silicon-containing material, composition containing th2025
Thermosetting iodine- and silicon-containing material, composition containing th2025
Thermosetting iodine- and silicon-containing material, composition containing th2025
Thermosetting iodine- and silicon-containing material, composition containing th2025
Composition for forming silicon-containing resist underlayer film, patterning pr2025
Bearing device for vehicle wheel2025