Iintegrated fan-out packages with embedded heat dissipation structure

Assignee

• TSMC

Inventors

• Hao-Jan Pei (34 patents)
• Wei-Yu Chen (673 patents)
• Chia-Shen Cheng (29 patents)
• Chih-Chiang Tsao (34 patents)
• Cheng-Ting Chen (46 patents)
• Chia-Lun Chang (31 patents)
• Chih-Wei Lin (283 patents)
• Hsiu-Jen Lin (136 patents)
• Ching-Hua Hsieh (198 patents)
• Chung-Shi Liu (743 patents)

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