Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Single wafer processing environments with spatial separation

Single wafer processing environments with spatial separation

US Patent 11894257 · Granted Feb 6, 2024

Estimated economic value: $39,056,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Atomic layer deposition coating system for inner walls of gas lines2025
Gas distribution plate2025
Gas distribution plate2025
Gas distribution plate2025
Gas distribution plate2025
Methods of operating a spatial deposition tool2025
Methods of operating a spatial deposition tool2025
Methods of operating a spatial deposition tool2025
Method of tuning film properties of metal nitride using plasma2025
Atomic layer deposition coatings for high temperature ceramic components2025
Plasma showerhead assembly and method of reducing defects2025
Plasma showerhead assembly and method of reducing defects2025