Package structure and manufacturing method thereof

Assignee

• TSMC

Inventors

• Wei-Yu Chen (673 patents)
• Chih-Hua Chen (125 patents)
• Ching-Hua Hsieh (198 patents)
• Hsiu-Jen Lin (136 patents)
• Yu-Chih Huang (80 patents)
• Yu-Peng Tsai (37 patents)
• Chia-Shen Cheng (29 patents)
• Chih-Chiang Tsao (34 patents)
• Jen-Jui Yu (11 patents)

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