Semiconductor device including bonding pad metal layer structure

Assignee

• Infineon Technologies Ag

Inventors

• Evelyn Napetschnig (24 patents)
• Jens Brandenburg (4 patents)
• Christoffer Erbert (4 patents)
• Joachim Hirschler (15 patents)
• Oliver Humbel (13 patents)
• Thomas Rupp (18 patents)
• Carsten Schaeffer (28 patents)
• Julia Zischang (2 patents)

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