Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12183696 | Semiconductor device including bonding pad metal layer structure | Evelyn Napetschnig, Jens Brandenburg, Christoffer Erbert, Joachim Hirschler, Oliver Humbel +2 more | 2024-12-31 |
| 11764176 | Semiconductor device including bonding pad metal layer structure | Evelyn Napetschnig, Jens Brandenburg, Christoffer Erbert, Joachim Hirschler, Oliver Humbel +2 more | 2023-09-19 |