Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Feed-forward of multi-layer and multi-process information using XPS and XRF technologies

Feed-forward of multi-layer and multi-process information using XPS and XRF technologies

US Patent 11733035 · Granted Aug 22, 2023

Estimated economic value: $21,818,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

System and method for measuring a sample by x-ray reflectance scatterometry2025
Characterizing and measuring in small boxes using XPS with multiple measurements2025
Characterizing and measuring in small boxes using XPS with multiple measurements2025
XPS metrology for process control in selective deposition2024
XPS metrology for process control in selective deposition2024
Method and system for non-destructive metrology of thin layers2024
Method and system for non-destructive metrology of thin layers2024
Method and system for non-destructive metrology of thin layers2024
Resistive switching memory having confined filament formation and methods thereo2024
Characterizing and measuring in small boxes using XPS with multiple measurements2024
Characterizing and measuring in small boxes using XPS with multiple measurements2024
Method and system for non-destructive metrology of thin layers2024