Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Method and system for non-destructive metrology of thin layers

Method and system for non-destructive metrology of thin layers

US Patent 11906451 · Granted Feb 20, 2024

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

System and method for measuring a sample by x-ray reflectance scatterometry2025
Characterizing and measuring in small boxes using XPS with multiple measurements2025
Characterizing and measuring in small boxes using XPS with multiple measurements2025
XPS metrology for process control in selective deposition2024
Method and system for non-destructive metrology of thin layers2024
Method and system for non-destructive metrology of thin layers2024
Method and system for non-destructive metrology of thin layers2024
Method and system for non-destructive metrology of thin layers2024
Resistive switching memory having confined filament formation and methods thereo2024
Characterizing and measuring in small boxes using XPS with multiple measurements2024
Characterizing and measuring in small boxes using XPS with multiple measurements2024
Method and system for optical characterization of patterned samples2024