{"@context": "https://schema.org", "@type": "BreadcrumbList", "itemListElement": [{"@type": "ListItem", "position": 1, "name": "Home", "item": "https://www.patentleaderboard.com/"}, {"@type": "ListItem", "position": 2, "name": "Package structure and manufacturing method thereof", "item": "https://www.patentleaderboard.com/patent/11710690"}]}

Home › Package structure and manufacturing method thereof

Package structure and manufacturing method thereof

US Patent 11710690 · Granted Jul 25, 2023

Assignee

Unimicron Technology

Inventors

John Hon-Shing Lau (33 patents)
Cheng-Ta Ko (55 patents)
Pu-Ju Lin (37 patents)
Kai-Ming Yang (43 patents)
Chia-Yu Peng (9 patents)
Chi-Hai Kuo (11 patents)
Tzyy-Jang Tseng (99 patents)

View full patent text on Google Patents →