Manufacturing method of package on package structure

Assignee

• TSMC

Inventors

• Hsuan-Ting Kuo (35 patents)
• Ching-Hua Hsieh (198 patents)
• Cheng-Ting Chen (46 patents)
• Hsiu-Jen Lin (136 patents)
• Hao-Jan Pei (34 patents)
• Yu-Peng Tsai (37 patents)
• Chia-Lun Chang (31 patents)
• Chih-Chiang Tsao (34 patents)
• Philip Yu-Shuan Chung (14 patents)

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