Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Semiconductor device and method of manufacture

Semiconductor device and method of manufacture

US Patent 11183399 · Granted Nov 23, 2021

Estimated economic value: $16,214,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Packages with multiple types of underfill and method forming the same2025
Photonic package and method of manufacture2025
Structure having thermal dissipation structure therein and manufacturing method 2025
Thermo-electric cooler for dissipating heat of optical engine2025
Bridge die having different surface orientation than IC dies interconnected by t2025
Integrated circuit package and method2025
Semiconductor device having underfill surrounding bottom package and solder ball2025
Apparatus, system and method2025
Chip stack structure with conductive plug and method for forming the same2025
3D integrated circuit (3DIC) structure2025
Integrated circuit package and method of forming same2025
Integrated circuit package and method2025