Chip stack structure with conductive plug and method for forming the same

Assignee

• TSMC

Inventors

• Chuei-Tang Wang (219 patents)
• Tso-Jung Chang (1 patents)
• Shih-Ping Lin (11 patents)
• Jeng-Shien Hsieh (35 patents)
• Chih-Peng Lin (9 patents)
• Chieh-Yen Chen (37 patents)
• Chen-Hua Yu (1,955 patents)

View full patent text on Google Patents →