Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › IC structure with interdigitated conductive elements between metal guard structures

IC structure with interdigitated conductive elements between metal guard structures

US Patent 10770407 · Granted Sep 8, 2020

Estimated economic value: $79,748,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Built-in circuit for testing process and layout effects of an integrated circuit2025
Photonic integrated circuit including passive optical guard2025
On-chip reliability monitor and method2025
Method and apparatus for faster bitcell operation2025
Photonics chips with thermal management for a cavity-mounted chip2025
Defect detection system for cavity in integrated circuit2025
PIC structure with wire(s) between z-stop supports on side of optical device att2025
Moisture detection along input/output opening in IC structure2025
Method and apparatus for self-destruction of device protected by a physical uncl2025
Bragg reflector for photonic chip security structure2025
IC structure moisture ingress detection by current hump in current-voltage respo2024
Thermo-optic phase shifters2024