Bump bond structure for enhanced electromigration performance

Assignee

• Texas Instruments

Inventors

• Dibyajat Mishra (3 patents)
• Ashok S. Prabhu (55 patents)
• Tomoko Noguchi (6 patents)
• Luu Thanh Nguyen (63 patents)
• Anindya Poddar (63 patents)
• Makoto Yoshino (63 patents)
• Hau Nguyen (28 patents)

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