Connector formation methods and packaged semiconductor devices

Assignee

• TSMC

Inventors

• Jung Wei Cheng (71 patents)
• Hai-Ming Chen (11 patents)
• Chien-Hsun Lee (136 patents)
• Hao-Cheng Hou (35 patents)
• Hung-Jen Lin (35 patents)
• Chun-Chih Chuang (17 patents)
• Ming-Che Liu (9 patents)
• Tsung-Ding Wang (101 patents)

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