Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Via formation using sidewall image transfer process to define lateral dimension

Via formation using sidewall image transfer process to define lateral dimension

US Patent 10157789 · Granted Dec 18, 2018

Estimated economic value: $3,830,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Double patterned microcooler having alternating fin widths2025
Selective gas etching for self-aligned pattern transfer2025
Vertical field effect transistor with minimal contact to gate erosion2025
Dual-metal ultra thick metal (UTM) structure2025
Skip-level TSV with hybrid dielectric scheme for backside power delivery2025
Dual structured buried rail2025
Circuit interconnect structure2025
Isolation rail between backside power rails2025
Backside power plane2025
Metal hard mask for precise tuning of mandrels2025
Magnetoresistive random-access memory (MRAM) with preserved underlying dielectri2025
Magnetoresistive random-access memory (MRAM) with preserved underlying dielectri2025