Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Integration of a self-forming barrier layer and a ruthenium metal liner in copper metallization

Integration of a self-forming barrier layer and a ruthenium metal liner in copper metallization

US Patent 10157784 · Granted Dec 18, 2018

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Thermal etching of ruthenium2025
Thermal etching of ruthenium2025
Metal hard mask integration2025
Metal hard mask integration2025
Method of conductive material deposition2025
Selective film formation using a self-assembled monolayer2025
Air conditioning apparatus2025
Conductive superlattice structures and methods of forming the same2025
Visual and audio multimodal searching system2025
Variable hardness amorphous carbon mask2025
System for backside deposition of a substrate2025
Air conditioner2025