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Home › Platform with thermally stable wireless interconnects

Platform with thermally stable wireless interconnects

US Patent 10083923 · Granted Sep 25, 2018

Estimated economic value: $26,257,000 ⓘ

Assignee

Intel

Inventors

Georgios Dogiamis (155 patents)
Sasha N. Oster (110 patents)
Telesphor Kamgaing (190 patents)
Adel A. Elsherbini (270 patents)
Brandon M. Rawlings (31 patents)
Feras Eid (190 patents)

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