Issued Patents All Time
Showing 51–75 of 75 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7209354 | Ball grid array package with heat sink device | Chung-Ju Wu | 2007-04-24 |
| 7193314 | Semiconductor devices and substrates used in thereof | Chung-Ju Wu, Wen-Yu Lo, Wen-Dong Yen | 2007-03-20 |
| 7145644 | Device and method for testing an exposure apparatus | Hung-Chi Wang | 2006-12-05 |
| 6933600 | Substrate for semiconductor package | Chung-Ju Wu, Kuei-Chen Liang | 2005-08-23 |
| 6882037 | Die paddle for receiving an integrated circuit die in a plastic substrate | Wei-Chi Liu, Chung-Ju Wu | 2005-04-19 |
| 6864586 | Padless high density circuit board | Han-Kun Hsieh | 2005-03-08 |
| 6838756 | Chip-packaging substrate | Chung-Ju Wu, Chen-Wen Tsai | 2005-01-04 |
| 6790758 | Method for fabricating conductive bumps and substrate with metal bumps for flip chip packaging | Han-Kun Hsieh | 2004-09-14 |
| 6765301 | Integrated circuit bonding device and manufacturing method thereof | Chung-Ju Wu, Kuei-Chen Liang | 2004-07-20 |
| 6753595 | Substrates for semiconductor devices with shielding for NC contacts | Chung-Ju Wu, Wen-Yu Lo, Wen-Dong Yen | 2004-06-22 |
| 6747350 | Flip chip package structure | Yin-Chieh Hsueh, Chung-Ju Wu | 2004-06-08 |
| 6744128 | Integrated circuit package capable of improving signal quality | Chung-Ju Wu, Kuei-Chen Liang | 2004-06-01 |
| 6720246 | Flip chip assembly process for forming an underfill encapsulant | Han-Kun Hsieh | 2004-04-13 |
| 6707677 | Chip-packaging substrate and test method therefor | Han-Kun Hsieh, Yi-Chang Hsieh | 2004-03-16 |
| 6670692 | Semiconductor chip with partially embedded decoupling capacitors | Ching-Chang Shih, Chun-An Tu, Tsung-Chi Hsu, Ming-Huan Lu | 2003-12-30 |
| 6653574 | Multi-layered substrate with a built-in capacitor design and a method of making the same | Chen-Wen Tsai, Chung-Ju Wu | 2003-11-25 |
| 6524942 | Bond pad structure and its method of fabricating | Chen-Wen Tsai, Chung-Ju Wu | 2003-02-25 |
| 6509646 | Apparatus for reducing an electrical noise inside a ball grid array package | Chung-Ju Wu, Chen-Wen Tsai | 2003-01-21 |
| 6498505 | Jigs for semiconductor components | Mu-Sheng Liao, Chen-Wen Tsai, Ching-Jung Huang | 2002-12-24 |
| 6395996 | Multi-layered substrate with a built-in capacitor design | Chen-Wen Tsai, Chung-Ju Wu | 2002-05-28 |
| 6365970 | Bond pad structure and its method of fabricating | Chen-Wen Tsai, Chung-Ju Wu | 2002-04-02 |
| 6251768 | Method of arranging the staggered shape bond pads layers for effectively reducing the size of a die | — | 2001-06-26 |
| 6116427 | Tray for ball grid array devices | Chung-Ju Wu, Chen-Wen Tsai | 2000-09-12 |
| 6057596 | Chip carrier having a specific power join distribution structure | Tony Ho | 2000-05-02 |
| 5497258 | Spatial light modulator including a VLSI chip and using solder for horizontal and vertical component positioning | Teh-Hua Ju, Yung-Cheng Lee | 1996-03-05 |