Issued Patents All Time
Showing 1–25 of 26 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12025295 | Wearable device and head strap module | Tsen-Wei Kung, Tsung-Hua Yang, Chih-Yao Chang, Wei Te Tu | 2024-07-02 |
| 11927303 | Wearable device | Tsen-Wei Kung, Tsung-Hua Yang, Chih-Yao Chang, Wei Te Tu | 2024-03-12 |
| 9897620 | Gas detection device and gas inlet module thereof | Sheng-Chieh Lin, Yao-Ting Tseng, Pin-Chung Sun, Chien-Lung Huang | 2018-02-20 |
| 9669408 | Slight volume collector | Sheng-Chieh Lin, Pin-Chung Sun, Yao-Ting Tseng, Shih-Jen Lu, Chien-Lung Huang | 2017-06-06 |
| 9547282 | Wearable device with wireless transmission and method for manufacturing the same | Chien-Chih Chen, Yen-Liang Kuo, Keng-Chih Lin, Chien-Ting Ho, Chien-Lung Huang +3 more | 2017-01-17 |
| 9475016 | Fluid mixing structure | Sheng-Chieh Lin, Pin-Chung Sun, Yao-Ting Tseng, Shih-Jen Lu, Chien-Lung Huang | 2016-10-25 |
| 8666456 | Handheld electronic apparatus | Cheng-Hsi Liu, Pi-Lin Lo, Jih-Jonq Shiue | 2014-03-04 |
| 8539462 | Method for allocating registers for a processor based on cycle information | Yu-Te Lin, Jenq Kuen Lee | 2013-09-17 |
| 8510539 | Spilling method involving register files based on communication costs and use ratio | Chia Han Lu, Jenq Kuen Lee | 2013-08-13 |
| 8051411 | Method for copy propagations for a processor with distributed register file design | Jenq Kuen Lee, Sheng-Yuan Chen | 2011-11-01 |
| 7307844 | Heat dissipation mechanism for electronic apparatus | — | 2007-12-11 |
| 7209354 | Ball grid array package with heat sink device | Wei-Feng Lin | 2007-04-24 |
| 7193314 | Semiconductor devices and substrates used in thereof | Wei-Feng Lin, Wen-Yu Lo, Wen-Dong Yen | 2007-03-20 |
| 6933600 | Substrate for semiconductor package | Kuei-Chen Liang, Wei-Feng Lin | 2005-08-23 |
| 6882037 | Die paddle for receiving an integrated circuit die in a plastic substrate | Wei-Feng Lin, Wei-Chi Liu | 2005-04-19 |
| 6838756 | Chip-packaging substrate | Wei-Feng Lin, Chen-Wen Tsai | 2005-01-04 |
| 6765301 | Integrated circuit bonding device and manufacturing method thereof | Kuei-Chen Liang, Wei-Feng Lin | 2004-07-20 |
| 6753595 | Substrates for semiconductor devices with shielding for NC contacts | Wei-Feng Lin, Wen-Yu Lo, Wen-Dong Yen | 2004-06-22 |
| 6747350 | Flip chip package structure | Wei-Feng Lin, Yin-Chieh Hsueh | 2004-06-08 |
| 6744128 | Integrated circuit package capable of improving signal quality | Kuei-Chen Liang, Wei-Feng Lin | 2004-06-01 |
| 6653574 | Multi-layered substrate with a built-in capacitor design and a method of making the same | Chen-Wen Tsai, Wei-Feng Lin | 2003-11-25 |
| 6524942 | Bond pad structure and its method of fabricating | Chen-Wen Tsai, Wei-Feng Lin | 2003-02-25 |
| 6509646 | Apparatus for reducing an electrical noise inside a ball grid array package | Wei-Feng Lin, Chen-Wen Tsai | 2003-01-21 |
| 6395996 | Multi-layered substrate with a built-in capacitor design | Chen-Wen Tsai, Wei-Feng Lin | 2002-05-28 |
| 6365970 | Bond pad structure and its method of fabricating | Chen-Wen Tsai, Wei-Feng Lin | 2002-04-02 |