Issued Patents All Time
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6838756 | Chip-packaging substrate | Wei-Feng Lin, Chung-Ju Wu | 2005-01-04 |
| 6653574 | Multi-layered substrate with a built-in capacitor design and a method of making the same | Chung-Ju Wu, Wei-Feng Lin | 2003-11-25 |
| 6524942 | Bond pad structure and its method of fabricating | Chung-Ju Wu, Wei-Feng Lin | 2003-02-25 |
| 6509646 | Apparatus for reducing an electrical noise inside a ball grid array package | Wei-Feng Lin, Chung-Ju Wu | 2003-01-21 |
| 6498505 | Jigs for semiconductor components | Mu-Sheng Liao, Wei-Feng Lin, Ching-Jung Huang | 2002-12-24 |
| 6423577 | Method for reducing an electrical noise inside a ball grid array package | Cheng Cheng, Chia-Wen Shih | 2002-07-23 |
| 6395996 | Multi-layered substrate with a built-in capacitor design | Chung-Ju Wu, Wei-Feng Lin | 2002-05-28 |
| 6365970 | Bond pad structure and its method of fabricating | Chung-Ju Wu, Wei-Feng Lin | 2002-04-02 |
| 6116427 | Tray for ball grid array devices | Chung-Ju Wu, Wei-Feng Lin | 2000-09-12 |
| 5219802 | Porous ceramic radiation plate | Ching-Sung Hsiao | 1993-06-15 |