Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8916980 | Pad and circuit layout for semiconductor devices | Tiejun Dai | 2014-12-23 |
| 6933600 | Substrate for semiconductor package | Chung-Ju Wu, Wei-Feng Lin | 2005-08-23 |
| 6765301 | Integrated circuit bonding device and manufacturing method thereof | Chung-Ju Wu, Wei-Feng Lin | 2004-07-20 |
| 6744128 | Integrated circuit package capable of improving signal quality | Chung-Ju Wu, Wei-Feng Lin | 2004-06-01 |