Issued Patents All Time
Showing 101–123 of 123 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6270437 | Belt for continuously variable transmission | Takamichi Shimada | 2001-08-07 |
| 6191038 | Apparatus and method for chemical/mechanical polishing | Masashi Hamanaka | 2001-02-20 |
| 6090004 | Belt for a continuously variable transmission | Shigeru Kanehara, Hirofumi Akagi, Tooru Yagasaki, Tooru Fujii, Shinya Kuwabara | 2000-07-18 |
| 5853347 | Continuously variable V-belt transmission | Takashi Aoki, Keiichi Hanyu | 1998-12-29 |
| 5800298 | Metal V-belt type continuously variable transmission | Shigeru Kanehara, Hirofumi Akagi, Hideaki Aoyama, Takamichi Shimada | 1998-09-01 |
| 5466488 | Method of making glazed AlN substrate with an Al.sub.2 O.sub.3 -SiO.sub.2 interfacial layer | Seiji Toyoda, Kunio Sugamura | 1995-11-14 |
| 5451279 | Method for joining ceramic sintered bodies | Masayoshi Kohinata, Makoto Toriumi, Hirokazu Tanaka | 1995-09-19 |
| 5213877 | Ceramic substrate used for fabricating electric or electronic circuit | Makoto Toriumi, Hirokazu Tanaka, Masao Umezawa, Michio Yuzawa, Yoshirou Kuromitsu | 1993-05-25 |
| 5212375 | Camera focus detection system using holographic beam splitter | Hisashi Goto, Tsutomu Uzawa, Yoshihiro Kawano, Hiroyuki Kurita, Akira Hasegawa +1 more | 1993-05-18 |
| 5134029 | Substrate used for fabrication of thick film circuit | Yoshiro Kuromitsu, Chuji Tanaka, Hiroto Uchida, Kenji Morinaga | 1992-07-28 |
| 5130498 | Ceramic substrate used for fabricating electric or electronic circuit | Yoshirou Kuromitsu, Makoto Toriumi, Michio Yuzawa | 1992-07-14 |
| 5123880 | Metallic V-belt | Noboru Sekine, Takashi Aoki, Shigeru Kanehara, Keiichi Hanyu | 1992-06-23 |
| 5124311 | Structure of ceramic superconductive wiring and process of fabrication thereof | Satoru Mori, Takuo Takeshita, Yoshio Kanda | 1992-06-23 |
| 5120417 | Magnetron sputtering apparatus and thin film depositing method | Nobuyuki Takahashi, Haruyuki Kochi, Yasuhiko Akao | 1992-06-09 |
| 5096768 | Substrate used for fabrication of thick film circuit | Yoshirou Kuromitsu, Toshiyuki Nagase, Hiroto Uchida, Tadaharu Tanaka, Yoshio Kanda +1 more | 1992-03-17 |
| 5087509 | Substrate used for fabrication of thick film circuit | Yoshirou Kuromitsu, Toshiyuki Nagase, Tadaharu Tanaka, Yoshio Kanda | 1992-02-11 |
| 4717436 | Wire for bonding a semiconductor device | Naoyuki Hosoda, Masaki Morikawa, Naoki Uchiyama, Toshiaki Ono | 1988-01-05 |
| 4676827 | Wire for bonding a semiconductor device and process for producing the same | Naoyuki Hosoda, Masaki Morikawa, Naoki Uchiyama, Toshiaki Ono | 1987-06-30 |
| 4632806 | Copper alloy having high resistance to oxidation for use in leads on semiconductor devices | Masaki Morikawa, Kunio Kishida | 1986-12-30 |
| 4534982 | Process for producing cream cheese type food | Hayato Kubota | 1985-08-13 |
| 4525434 | Copper alloy having high resistance to oxidation for use in leads on semiconductor devices and clad material containing said alloy | Masaki Morikawa, Kunio Kishida | 1985-06-25 |
| 4416853 | Cu-Ag base alloy brazing filler material | Masaki Morikawa, Kunio Kishida, Chuji Tanaka | 1983-11-22 |
| 4411864 | Cu-Ag-Si Base alloy brazing filler material | Masaki Morikawa, Kunio Kishida, Chuji Tanaka | 1983-10-25 |