Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5282946 | Platinum-cobalt alloy sputtering target and method for manufacturing same | Makoto Kinoshita, Jun Tamura, Masaki Morikawa, Toshinori Ishii, Akifumi Mishima | 1994-02-01 |
| 4632806 | Copper alloy having high resistance to oxidation for use in leads on semiconductor devices | Masaki Morikawa, Hideaki Yoshida | 1986-12-30 |
| 4525434 | Copper alloy having high resistance to oxidation for use in leads on semiconductor devices and clad material containing said alloy | Masaki Morikawa, Hideaki Yoshida | 1985-06-25 |
| 4416853 | Cu-Ag base alloy brazing filler material | Masaki Morikawa, Hideaki Yoshida, Chuji Tanaka | 1983-11-22 |
| 4411864 | Cu-Ag-Si Base alloy brazing filler material | Masaki Morikawa, Hideaki Yoshida, Chuji Tanaka | 1983-10-25 |