Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5134029 | Substrate used for fabrication of thick film circuit | Yoshiro Kuromitsu, Hideaki Yoshida, Hiroto Uchida, Kenji Morinaga | 1992-07-28 |
| 4416853 | Cu-Ag base alloy brazing filler material | Masaki Morikawa, Hideaki Yoshida, Kunio Kishida | 1983-11-22 |
| 4411864 | Cu-Ag-Si Base alloy brazing filler material | Masaki Morikawa, Hideaki Yoshida, Kunio Kishida | 1983-10-25 |
| 4354301 | Method for manufacturing stripe-patterned metal plate | Yo Takeuchi, Masaki Morikawa, Toshiharu Hiji, Hiroshi Ikeda | 1982-10-19 |