Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8721961 | Au—Sn alloy bump including no large void and method of producing same | Masayuki Ishikawa, Akifumi Mishima | 2014-05-13 |
| 7556669 | Au-sn alloy powder for solder paste | Masayuki Ishikawa, Akihumi Mishima | 2009-07-07 |
| 5651873 | Electroplating solution for forming Pb-Sn alloy bump electrodes on semiconductor wafer surface | Naoki Uchiyama, Akihiro Masuda, Yoshiaki Okuhama, Seishi Masaki, Masakazu Yoshimoto | 1997-07-29 |
| 5451279 | Method for joining ceramic sintered bodies | Makoto Toriumi, Hirokazu Tanaka, Hideaki Yoshida | 1995-09-19 |