Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5651873 | Electroplating solution for forming Pb-Sn alloy bump electrodes on semiconductor wafer surface | Naoki Uchiyama, Masayoshi Kohinata, Akihiro Masuda, Yoshiaki Okuhama, Masakazu Yoshimoto | 1997-07-29 |
| 5618404 | Electrolytic process for producing lead sulfonate and tin sulfonate for solder plating use | Yoshiaki Okuhama, Takao Takeuchi, Yoshiharu Matsuda, Masakazu Yoshimoto | 1997-04-08 |
| 4673470 | Tin, lead, or tin-lead alloy plating bath | Keigo Obata, Nobuyasu Dohi, Yoshiaki Okuhama, Yukiyoshi Okada, Masakazu Yoshimoto | 1987-06-16 |
| 4555314 | Tin-lead alloy plating bath | Keigo Obata, Nobuyasu Dohi, Yoshiaki Okuhama, Yukiyoshi Okada, Tadashi Yoshida | 1985-11-26 |
| 4459185 | Tin, lead, and tin-lead alloy plating baths | Keigo Obata, Nobuyasu Dohi, Yoshiaki Okuhama, Yukiyoshi Okada, Masakazu Yoshimoto | 1984-07-10 |