Issued Patents All Time
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12104326 | Decay-resistant paper | Takuya Nakagawa, Yasuomi OTA, Hideaki Yamada, Seiichiro Nakao | 2024-10-01 |
| 7166152 | Pretreatment solution for providing catalyst for electroless plating, pretreatment method using the solution, and electroless plated film and/or plated object produced by use of the method | Keigo Obata, Masakazu Yoshimoto, Kim Dong Hyun, Shingo Kitamura, Seiichiro Nakao +2 more | 2007-01-23 |
| 7056448 | Method for forming circuit pattern | Keigo Obata, Masakazu Yoshimoto, Shingo Kitamura, Seiichiro Nakao, Osamu Masuyama +1 more | 2006-06-06 |
| 6235093 | Aqueous solutions for obtaining noble metals by chemical reductive deposition | Takao Takeuchi, Keigo Obata, Yasuhito Kohashi, Hidemi Nawafune | 2001-05-22 |
| 6183545 | Aqueous solutions for obtaining metals by reductive deposition | Takao Takeuchi, Masakazu Yoshimoto, Shigeru Takatani, Emiko Tanaka, Masayuki Nishino +8 more | 2001-02-06 |
| 5651873 | Electroplating solution for forming Pb-Sn alloy bump electrodes on semiconductor wafer surface | Naoki Uchiyama, Masayoshi Kohinata, Akihiro Masuda, Seishi Masaki, Masakazu Yoshimoto | 1997-07-29 |
| 5618404 | Electrolytic process for producing lead sulfonate and tin sulfonate for solder plating use | Seishi Masaki, Takao Takeuchi, Yoshiharu Matsuda, Masakazu Yoshimoto | 1997-04-08 |
| 4673470 | Tin, lead, or tin-lead alloy plating bath | Keigo Obata, Nobuyasu Dohi, Seishi Masaki, Yukiyoshi Okada, Masakazu Yoshimoto | 1987-06-16 |
| 4555314 | Tin-lead alloy plating bath | Keigo Obata, Nobuyasu Dohi, Seishi Masaki, Yukiyoshi Okada, Tadashi Yoshida | 1985-11-26 |
| 4459185 | Tin, lead, and tin-lead alloy plating baths | Keigo Obata, Nobuyasu Dohi, Seishi Masaki, Yukiyoshi Okada, Masakazu Yoshimoto | 1984-07-10 |