Issued Patents All Time
Showing 1–16 of 16 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11945962 | Cationic electrodeposition coating composition and method for forming cured electrodeposition coating film | Masayuki Kotani, Yuko HASEGAWA, Yasuyuki FURUYA, Keisuke Tsutsui, Hiroki Arai +1 more | 2024-04-02 |
| 7938948 | Silver and silver alloy plating bath | Kiyotaka Tsuji, Tetsuji Nishikawa, Takao Takeuchi, Hidemi Nawafune | 2011-05-10 |
| 7669752 | Flux for soldering and circuit board | Kazuki Ikeda, Shunsuke Ishikawa, Takaaki Anada, Takao Takeuchi, Naoya Inoue | 2010-03-02 |
| 7628903 | Silver and silver alloy plating bath | Kiyotaka Tsuji, Tetsuji Nishikawa, Takao Takeuchi, Hidemi Nawafune | 2009-12-08 |
| 7166152 | Pretreatment solution for providing catalyst for electroless plating, pretreatment method using the solution, and electroless plated film and/or plated object produced by use of the method | Yoshiaki Okuhama, Masakazu Yoshimoto, Kim Dong Hyun, Shingo Kitamura, Seiichiro Nakao +2 more | 2007-01-23 |
| 7056448 | Method for forming circuit pattern | Yoshiaki Okuhama, Masakazu Yoshimoto, Shingo Kitamura, Seiichiro Nakao, Osamu Masuyama +1 more | 2006-06-06 |
| 6923875 | Solder precipitating composition | Kazuki Ikeda, Hiroshi Tanaka, Hisao Irie, Takao Takeuchi, Naoya Inoue | 2005-08-02 |
| 6852210 | Plating method and plating bath precursor used therefor | Dong Hyun Kim, Takao Takeuchi, Seiichiro Nakao, Shinji Inazawa, Ayao Kariya +2 more | 2005-02-08 |
| 6607653 | Plating bath and process for depositing alloy containing tin and copper | Kiyotaka Tsuji, Takao Takeuchi, Hidemi Nawafune, Tetsuji Nishikawa | 2003-08-19 |
| 6338787 | Redox system electroless plating method | Dong Hyun Kim, Takao Takeuchi, Seiichiro Nakao, Shinji Inazawa, Ayao Kariya +2 more | 2002-01-15 |
| 6235093 | Aqueous solutions for obtaining noble metals by chemical reductive deposition | Yoshiaki Okuhama, Takao Takeuchi, Yasuhito Kohashi, Hidemi Nawafune | 2001-05-22 |
| 6183545 | Aqueous solutions for obtaining metals by reductive deposition | Yoshiaki Okuhama, Takao Takeuchi, Masakazu Yoshimoto, Shigeru Takatani, Emiko Tanaka +8 more | 2001-02-06 |
| 4992154 | Brush for electrolytic treatment | Yoshiaki Ida | 1991-02-12 |
| 4673470 | Tin, lead, or tin-lead alloy plating bath | Nobuyasu Dohi, Yoshiaki Okuhama, Seishi Masaki, Yukiyoshi Okada, Masakazu Yoshimoto | 1987-06-16 |
| 4555314 | Tin-lead alloy plating bath | Nobuyasu Dohi, Yoshiaki Okuhama, Seishi Masaki, Yukiyoshi Okada, Tadashi Yoshida | 1985-11-26 |
| 4459185 | Tin, lead, and tin-lead alloy plating baths | Nobuyasu Dohi, Yoshiaki Okuhama, Seishi Masaki, Yukiyoshi Okada, Masakazu Yoshimoto | 1984-07-10 |