Issued Patents All Time
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7798389 | Flux for soldering, soldering method, and printed circuit board | Kazuki Ikeda, Toshinori Shima, Takaaki Anada, Syunsuke Ishikawa | 2010-09-21 |
| 7503958 | Method of manufacturing the SnZnNiCu solder powder and the SnZnNiCu solder powder | Eiichiro Matsubara, Tetsu ICHITSUBO, Takaaki Anada, Seishi Kumamoto | 2009-03-17 |
| 6923875 | Solder precipitating composition | Kazuki Ikeda, Hiroshi Tanaka, Keigo Obata, Takao Takeuchi, Naoya Inoue | 2005-08-02 |
| 5296649 | Solder-coated printed circuit board and method of manufacturing the same | Izumi Kosuga, Kenichi Fuse, Takao Fukunaga, Hirokazu Shiroishi, Masanao Kohno | 1994-03-22 |
| 5145532 | Solder precipitating composition | Takao Fukunaga, Hisao Nakajima, Kenzo Kobayashi, Masanao Kono, Ryo Inoue | 1992-09-08 |
| 5118029 | Method of forming a solder layer on pads of a circuit board and method of mounting an electronic part on a circuit board | Kenichi Fuse, Takao Fukunaga, Masanao Kohno | 1992-06-02 |
| 5021269 | Method for forming a metal film on the surface of a substrate metal | Masanao Kono, Yoshihiro Hasegawa, Yasutaka Nishi, Tatsuji Mizuta, Shinsuke Ohara | 1991-06-04 |