Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7503958 | Method of manufacturing the SnZnNiCu solder powder and the SnZnNiCu solder powder | Eiichiro Matsubara, Tetsu ICHITSUBO, Takaaki Anada, Hisao Irie | 2009-03-17 |
| 7452797 | Solder deposition method and solder bump forming method | Youichi Kukimoto, Hitoshi Sakurai, Kenshu Oyama | 2008-11-18 |
| 5601228 | Solder-precipitating composition and mounting method using the composition | Takao Fukunaga, Kazuhito Higasa, Hirokazu Shiroishi, Takahiro Fujiwara, Noriko Katayama | 1997-02-11 |
| 5453582 | Circuit board to be precoated with solder layers and solder circuit board | Toshiaki Amano, Kazuhito Hikasa, Takahiro Fujiwara | 1995-09-26 |