YK

Youichi Kukimoto

HI Harima Chemicals, Incorporated: 1 patents #79 of 188Top 45%
📍 Kakogawa, JP: #405 of 707 inventorsTop 60%
Overall (All Time): #3,370,429 of 4,157,543Top 85%
1
Patents All Time

Issued Patents All Time

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
7452797 Solder deposition method and solder bump forming method Hitoshi Sakurai, Seishi Kumamoto, Kenshu Oyama 2008-11-18