Issued Patents All Time
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5626937 | Composite cards | Masaki Morikawa, Naoki Uchiyama | 1997-05-06 |
| 5364482 | Composite cards | Masaki Morikawa, Naoki Uchiyama | 1994-11-15 |
| 5120589 | Composite cards | Masaki Morikawa, Naoki Uchiyama | 1992-06-09 |
| 5071619 | Fine gold alloy wire for bonding of a semiconductor device | Masayuki Tanaka, Tamotsu Mori | 1991-12-10 |
| 4885135 | Fine gold alloy wire for bonding of a semi-conductor device | Masayuki Tanaka, Tamotsu Mori | 1989-12-05 |
| 4726859 | Wire for bonding a semiconductor device | Naoki Uchiyama, Toshiaki Ono, Ryusuke Kawanaka | 1988-02-23 |
| 4717436 | Wire for bonding a semiconductor device | Masaki Morikawa, Naoki Uchiyama, Hideaki Yoshida, Toshiaki Ono | 1988-01-05 |
| 4676827 | Wire for bonding a semiconductor device and process for producing the same | Masaki Morikawa, Naoki Uchiyama, Hideaki Yoshida, Toshiaki Ono | 1987-06-30 |
| 4663141 | Process for recovering or purifying selenium | Noboru Sonoda, Kazumasa Hori | 1987-05-05 |
| 4512950 | Lead alloy soft solder containing radioactive particles used to make more reliable semiconductor devices | Naoki Uchiyama, Ryusuke Kawanaka | 1985-04-23 |